System for testing a semiconductor device

ABSTRACT

A system including an interposer and a coupler for electrically coupling a semiconductive device to an electrical apparatus. The system also includes (i) a substrate comprised of an electrically insulating, thermally conductive ceramic material; and (ii) an electrical conductor on the substrate having a receiving end for connecting to a semiconductive device and a terminal end for connecting to an electrical apparatus. The semiconductive device is electrically coupled to the electrical apparatus when the semiconductive device is connected to the receiving end of the electrical conductor and the terminal end of the electrical conductor is connected to the electrical apparatus. A thermally conductive coupler or connector connects the semiconductive device to the interposer. The thermally conductive interposer and connector conduct heat from the semiconductive device to the environment, thereby protecting the semiconductive device from overheating.

RELATED APPLICATIONS

[0001] This is a divisional application of U.S. patent application Ser.No. 09/123,633, filed on Jul. 28, 1998, titled “THERMALLY CONDUCTIVEINTERPOSER AND METHOD” which is incorporated herein by reference.

BACKGROUND OF THE INVENTION

[0002] 1. The Field of the Invention

[0003] This invention is in the field of semiconductive devicetechnology. More specifically, this invention is in the field ofinterposers for electrically connecting semiconductive devices to anelectrical apparatus.

[0004] 2. The Relevant Technology

[0005] A semiconductive device is often electrically coupled to anelectrical apparatus such as a computer through the use of aninterposer. In one such process, the semiconductive device is connectedto the interposer, which is then inserted into the socket of theelectrical apparatus. The socket may be mounted on the motherboard of acomputer, for example. Thus, the semiconductive device communicateselectrically through the interposer with the electrical apparatus.Typical interposers currently employed in the coupling of semiconductivedevices to electrical apparatuses are comprised of an FR4 fiberglassmaterial, or the like, having electrically conductive metal lines ortraces thereon.

[0006] The term “semiconductive device” extends to any device orassembly that includes circuitry defined in a semiconductive material,and further extends to a chip package that includes semiconductivematerial. The external and additional structure of a package assemblymay be used, for example, for mounting the semiconductive device to aprinted circuit board or other external circuitry, for establishingelectrical connection between the semiconductive device and externalcircuitry, for improving the ease of handling or transporting thesemiconductive device, and/or for protecting the semiconductive devicefrom environmental conditions. Many chip packages include a lead framethat extends beyond the body thereof. The lead frame typically includesan array of electrical leads that extend from the internal circuitry ofthe integrated circuit to the exterior portion of the chip package wherethey are exposed to the surroundings.

[0007] Frequently, after a semiconductive device is manufactured, atesting process is conducted on the semiconductive device by subjectingit to a preselected set of input conditions in order to measure itsresponse or other parameters. Testing of an integrated circuit packagethat includes a lead frame assembly is conventionally conducted byproviding temporary electrical communication between the leads andtesting circuitry. For example, such temporary electrical connection maybe established by using a set of probes, pins, sockets, or the like, tocontact the leads. The integrated circuit package may be clamped orotherwise secured in position during the testing operation in order forthe leads to remain in electrical contact with the corresponding probes,pins, sockets, etc., of the testing circuitry.

[0008] Semiconductive devices, such as DRAMs and SRAMs, undergosignificant stresses when in use. Particularly modern, high speed,advanced-integration semiconductive devices generate a significantamount of heat during use. This heat can degrade and slow downsemiconductive devices. For example, testing of semiconductive devicesto determine the quality and capability of the devices can generate suchheat within the devices that the testing process itself damages thedevices. Typical fiberglass interposers do not dissipate heat sufficientto protect semiconductive devices from the potential of damage caused bythe heat generated during use of the device.

[0009] In addition, typical fiberglass interposers are made of glassfibers and epoxy resin. The resulting interposer has a coefficient ofthermal expansion which is incompatible with typical semiconductivedevices. The coefficient of thermal expansion of the fiberglass is oftensignificantly greater than that of the semiconductive device.

[0010] As a result of this thermal expansion incompatibility, shearstresses develop in the interface between the interposer and thesemiconductive device when the semiconductive device becomes hot. Theseshear stresses can result in a severing of the electrical connectionbetween the interposer and the semiconductive device. While it ispossible to ameliorate the effects of shearing through a process knownas wire bonding, this process adds additional complexity and expense.Furthermore, the organic material within FR4 fiberglass interposersabsorbs moisture, causing the interposers to degrade.

[0011] There is therefore a need in the art for an improved interposerwhich assists in protecting a semiconductive device coupled to theinterposer from the potential damage caused by significant amounts ofheat generated by the semiconductive device. There is also a need in theart for an improved interposer which prevents shear stress from severingthe electrical connection between the interposer and the semiconductivedevice.

SUMMARY OF THE INVENTION

[0012] An interposer of the present invention is comprised of (i) asubstrate comprised of an electrically insulating, thermally conductiveceramic material; and (ii) an electrical conductor on the substratehaving a receiving end for connecting to a semiconductive device and aterminal end for connecting to an electrical apparatus. Thesemiconductive device is electrically coupled to the electricalapparatus when the semiconductive device is connected to the receivingend of the electrical conductor and the terminal end of the electricalconductor is connected to the electrical apparatus. The invention alsoincludes thermally conductive connections between the semiconductivedevice and an interposer.

[0013] In one embodiment, a thermally conductive connector connects thesemiconductive device, such as an SRAM, DRAM, or integrated circuitdevice, to the interposer such that a portion of the semiconductivedevice is exposed to the atmosphere to thereby dissipate heat to theatmosphere. Both the thermally conductive interposer and the thermallyconductive connector act as heat sinks to conduct heat from thesemiconductive device to the ambient, thereby protecting thesemiconductive device from overheating. The interposer preferably has acoefficient of thermal expansion which is substantially similar to thecoefficient of thermal expansion of a semiconductive device on theinterposer, thereby preventing shearing of the electrical connectionbetween the semiconductive device and the interposer.

[0014] In one embodiment, the semiconductive device is fastenedtemporarily and removably to the interposer and the interposer iscoupled to an electrical apparatus. In another embodiment, thesemiconductive device is permanently coupled to the interposer. As anexample of a connector, a biasing clip enables quick and convenientplacement and removal of semiconductive devices on the interposer. Theinterposer may be permanently or removably coupled to the electricalapparatus, depending on the desired application.

[0015] These and other features of the present invention will becomemore fully apparent from the following description and appended claims,or may be learned by the practice of the invention as set forthhereinafter.

BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order that the manner in which the above-recited and otheradvantages of the invention are obtained, a more particular descriptionof the invention briefly described above will be rendered by referenceto specific embodiments thereof which are illustrated in the appendeddrawings. Understanding that these drawings depict only typicalembodiments of the invention and are not therefore to be considered tobe limiting of its scope, the invention will be described and explainedwith additional specificity and detail through the use of theaccompanying drawings in which:

[0017]FIG. 1 is a perspective view of an interposer kit of the presentinvention showing one trace array empty, one trace array having asemiconductive device thereon, and one trace array having asemiconductive device thereon with a biasing connector coupling thesemiconductive device to the interposer.

[0018]FIG. 2 is a bottom surface view of a semiconductive device.

[0019]FIG. 3 is a perspective view of a biasing connector of the presentinvention.

[0020]FIG. 4 is a perspective view of another embodiment of a biasingconnector of the present invention.

[0021]FIG. 5 is a perspective view of the interposer kit shown in FIG. 1with an additional biasing connector and semiconductive device placedthereon.

[0022]FIG. 6 is a cross-sectional, cut-away view of the semiconductivedevice and the interposer shown in FIG. 1.

[0023]FIG. 7 is a cross-sectional, cut-away view of another embodimentof a semiconductive device and interposer.

[0024]FIG. 8 is a cross sectional, cut away view of the interposer ofFIG. 1 having an insulating layer on the intermediate portion of aconductor thereof.

[0025]FIG. 9 is a schematic view of an electrical apparatus shown asreceiving the interposer kit shown in FIG. 5.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0026] With reference now to FIGS. 1 and 2, the present inventionrelates to an interposer system 10 comprising (i) an interposer 12; and(ii) a connector 14 for connecting a semiconductive device 16 tointerposer 12. Interposer 12 is configured to electrically couplesemiconductive device 16 to an electrical apparatus (not shown in FIG.1), such as a testing apparatus which monitors, tests or evaluatesdevice 16, by for example storing information on device 16 andretrieving information from device 16.

[0027] Interposer 12 is electrically coupled to the electricalconnections 17 of device 16, the bottom surface of which is shown inFIG. 2, and to electrical connections on an electrical apparatus,thereby electrically coupling semiconductive device 16 to the electricalapparatus. By coupling semiconductive devices 16 on interposer 12, andcoupling interposer 12 to the electrical apparatus, the electricalapparatus may perform a variety of functions upon the semiconductivedevices, while the semiconductive devices are protected from overheatingby the heat dissipating qualities of interposer 12.

[0028] Interposer 12 and preferably, connector 14, are thermallyconductive. As shown in FIG. 1, system 10 preferably exposessemiconductive device 16 partially to the open atmosphere, rather thancompletely covering devices 16 with a connector, allowing heat todissipate to the atmosphere directly from semiconductive device 16. Inaddition, heat is transferred through thermally conductive interposer 12and connector 14 from semiconductive device 16, then dissipated to theatmosphere. The thermal conductivity of interposer 12 and connector 14,along with the configuration of interposer 12 and connector 14 aresignificant advantages within the art.

[0029] Interposer 12 will now be discussed in additional detail.Interposer 12 is comprised of a substrate 18 and a plurality ofelectrical conductors 20 on substrate 18. Substrate 18 is comprised ofan electrically insulating material. Substrate 18 also conducts heat,thereby dissipating heat away from device 16 connected to substrate 18.When exposed to the high temperatures generated by advanced highdensity, high integration devices 16, substrate 18 does not warp or bow.Substrate 18 has formed thereon electrical conductors 20, such as metaltraces. Substrate 18 also preferably has substantially similar thermalexpansion properties as semiconductor device 16, such as a substantiallysimilar coefficient of thermal expansion as that of semiconductivedevice 16. By having substantially similar thermal expansion properties,shear stress is reduced in the physical connections between device 16and interposer 12 so as to prevent a severing of the electricalconnection between device 16 and interposer 12.

[0030] In one embodiment, substrate 18 is comprised of a ceramicmaterial, such as an inorganic ceramic material. Examples of ceramicmaterials used in the production of substrate 18 include glass. Manyforms of glass may be used, including glass comprising silicates,silica, silicon oxide, phosphates, or borates, or derivatives thereof.Such glass may be doped with metal, an oxide or other elements, so longas it remains electrically insulative. Glass may be formed by fusingsilica with a basic oxide, for example. Borophosphosilicate glass is oneexample of a material useful for substrate 18. Inorganic forms of glassare preferable. Glass materials often have substantially similar thermalexpansion properties as semiconductive devices 16, which are oftensubstantially comprised in the most part of silicon or othersemiconductive material.

[0031] In addition to glass, other ceramics useful in the presentinvention as substrate 18 include alumina, aluminum nitrides,nonmetallic nitrides, nonmetallic carbides, single oxide ceramics, mixedoxide ceramics, and mixtures and derivatives thereof. As used throughoutthis specification and the appended claims, the term “nonmetallicnitrides” includes boron nitrides, silicon nitrides and othertransitional element nitrides. Alumina, for example, may be used aloneor in combination with silica or silicates, for example, because aluminaresists harsh environments and also dissipates heat.

[0032] Other examples of ceramics useful in the present invention forsubstrate 18 include glass ceramics, such as nucleated glass having anonporous, substantially crystalline structure, devitrified ceramics, orvitro ceramics. In one embodiment, glass ceramics are fine-grainedsubstantially crystalline materials made through controlledcrystallization from glass compositions containing nucleating agents.Thus, in one embodiment, substrate 18 comprises a material selected fromthe group consisting of glass, alumina, glass ceramic, aluminum nitride,nonmetallic nitride, nonmetallic carbide, and mixtures and derivativesthereof. Other possible, but less preferred ceramics for substrate 18include refractories such as steatite and mullite.

[0033] Glass and other ceramics are preferably provided in asubstantially homogeneous form for substrate 18, as opposed to theheterogeneous mixture of fibers and epoxy found in FR4 fiberglass. Glassand other ceramics are also preferably provided in substrate 18 in asubstantially planar (i.e., flat) sheet, as shown in FIG. 1.

[0034] As shown in FIG. 1, interposer 12 includes a plurality of arrays22, 24, 26 of electrical conductors 20 thereon. Each electricalconductor 20 has a receiving end 28 for connecting to a correspondingterminal 30 of an electrical conductor 32 on the bottom surface ofsemiconductive device 16 as shown in FIG. 2. Each electrical conductor20 on substrate 18 further comprises a terminal end 34 for connecting toan electrical apparatus. An intermediate portion 36 of conductor 20extends between receiving end 28 and terminal end 34 of each conductor20. The connection of terminal end 34 to the electrical apparatus may bepermanent or removable.

[0035] An interposer of the present invention may comprise a singleconductor or a plurality of conductors. The interposer may have a singlearray of conductors or may have a plurality of arrays, such as arrays22, 24, 26 as shown in FIG. 1. Each array may have as many conductors asneeded to electrically couple a particular semiconductive device, suchas device 16, to an electrical apparatus. Conductors may have a varietyof different configurations any of which are designed to electricallycouple a semiconductive device to an electrical apparatus. Heatdissipates to the environment through the conductors and from theconductors through the substrate to the ambient.

[0036] In one embodiment, the semiconductive device is permanentlycoupled to the interposer. The semiconductive device may be permanentlycoupled to the interposer through the use of an adhesive, for example,which is another example of a connector. In an underfilling process,adhesive is placed around the edges of semiconductive device 16 mountedon interposer 12, then the adhesive is permitted to wick throughcapillary action between interposer 12 and semiconductive device 16.This process can be repeated until the desired bond is achieved betweeninterposer 12 and the semiconductive device 16. This underfillingprocess is often used for flip chips, for example. Preferably, theadhesive is a thermally conductive adhesive, such as a silver-filledepoxy, or a tape having acrylics filled with alumina or aluminum nitridewith a matrix in resin. The thermally conductive adhesive enhances heatdissipation away from semiconductive device 16. Adhesives may be appliedusing a screen printing process, for example.

[0037] In another embodiment, semiconductive device 16 is removablycoupled to interposer 12, such as when it is desired to test device 16by coupling device 16 to testing apparatus which monitors, tests, and/orevaluates device 16. Preferably, when removability is desired,connectors such as resilient biasing connectors 14 are employed. Asshown in FIG. 1, biasing connector 14 connects device 16 to interposer12 such that a substantial portion of device 16 is exposed to the openenvironment thereby assisting in dissipating heat from device 16.

[0038] With reference now to FIGS. 3, 4, and 5, various embodiments ofbiasing connectors are demonstrated. As shown in FIG. 3, connector 14comprises a resilient clip having a top plate 38, a bottom plate 40, andan intermediate portion 42 coupling top plate 38 to bottom plate 40.Connector 14 may be employed to resiliently, removably biassemiconductive device 16 against interposer 12.

[0039] Another embodiment of a connector 44 is demonstrated in FIG. 4.Connector 44 comprises a resilient clip having an upper plate 46, alower plate 48 and an intermediate portion 50 coupling upper plate 46 tolower plate 48. Each of plates 46, 48 include a bow in the centralportion thereof. The bow in plates 46, 48 allowing front ends 52, 54 ofclip 44 to be readily biased open and closed manually for placement overdevice 16 and substrate 12.

[0040] As shown in FIG. 5, in one embodiment one connector 14 is usedfor a single semiconductive device 16, whereas in another embodiment asingle connector 56 is used to couple a plurality of semiconductivedevices 16 to interposer 12. Connector 56 may be in the shape of clip14, clip 44, or a variety of other clips or other configurations. Avariety of different designs of connectors may be employed in thepresent invention such as other clips, crimps, clamps and a variety ofother connectors having shapes and configurations which allow them toresiliently, removably bias semiconductive devices 16 to interposer 12.

[0041] In a preferred embodiment, heat is also conducted through athermally conductive connector to the environment. Biasing connectors14, 44, and 56 are preferably comprised of a resilient, heat dissipatingmaterial such as copper, copper alloy, or another metal. The connectorsare also insulated from the electrical connections on devices 16, suchas by being further comprised of or coated with an electricallyinsulating material, such as glass or polymer or by being placed onelectrically insulating portions of devices 16. The connectors thusresiliently, removably bias semiconductive devices 16 against interposer12 while simultaneously assisting in dissipating the heat generated bydevices 16 in conducting the heat to the atmosphere. These connectors doso in a manner which allows a portion of the device itself to be exposedto the atmosphere, thereby increasing the dissipative qualities ofsystem 10.

[0042] Connectors 14, 44, 56 dissipate heat because they are in intimatethermal contact with devices 16 and because they are comprised of athermally conductive material. Connectors 14, 44, 56 and other suchconnectors may be placed on device 16 manually or automatically. Oneadvantage of such connectors over an underfilling process is that theconnectors do not need a delay time in which wicking occurs and theyavoid the further delay of repeated applications, as well as delaysassociated with curing of the adhesive.

[0043] Connectors 14, 44, 56 or a variety of substantially similarconnectors may also be employed to assist in permanently couplingdevices 16 to substrate 18, thereby providing heat dissipation. Forexample, it is possible to employ both an adhesive, such as a thermallyconductive adhesive and a connector, such as connector 14, 44, or 56 topermanently couple semiconductive device 16 to interposer 12. This maybe accomplished, for example, by placing adhesive between substrate 18and semiconductive device 16 with a connector 14, 44, or 56 to coupleboth substrate 18 and device 16 together and/or by placing the adhesivebetween connector 14, 44, or 56 and substrate 18, for example. Adhesivemay also be placed between connector 14, 44, or 56 and device 16 so longas the electrical connections between connector 14, 44, or 56 and device16 are preserved.

[0044] Conductors 20 may be conventionally formed on substrate 18 bybeing attached or deposited thereon. For example, a metal can besputtered onto substrate 18, followed by a patterning process to defineconductors 20. Other conventional metallizing or metal line depositionprocesses can also be used. In one embodiment, substrate 18 is initiallyetched, after which the etched portion is metallized, by metaldeposition and a metal line patterning process. Metal deposition andphotolithographic metallization processes may be used to etch fine linewidths and to place conductors in dense arrays on substrates to forminterposers.

[0045] As shown in FIG. 6, in one embodiment, electrical conductor 20has a bumped receiving end 28 which projects from the upper surface ofsubstrate 18. In this embodiment, semiconductive device 16 includes acorresponding electrical conductor 32 having a bumped terminal 30 whichcouples to receiving end 28, thereby forming a connection between bump30 and bump 28 when device 16 and interposer 12 are connected togethersuch that bumps 28 and 30 interface. This creates a physical connectionbetween substrate 18 and device 16. This configuration allows bumps 28,30 to slide against one another, permitting convenient coupling of bumps28, 30 together as well as removal of bumps 28, 30 one from another.

[0046] In another embodiment, as shown in FIG. 7, the electricalconnection between an interposer 59 and a semiconductive device 58 iscreated by providing for a complimentary, male/female connection betweendevice 58 and interposer 59. Although interposer 59 is shown ascomprising the female fitting, the interposer may comprise the malefitting, as shown in FIG. 6 with protruding bumped receiving end 28,while the semiconductive device comprises the female fitting which isformed in a recess of the semiconductive device.

[0047] In the embodiment shown in FIG. 7, interposer 59 comprises asubstrate 60 having a recess 62 therein. A conductor 64 such as a metaltrace is placed on substrate 60 such that a receiving end 66 ofconductor 64 is disposed within recess 62, which is below the uppersurface of substrate 60, allowing a male connecting terminal 68 of aconductor on semiconductive device 58 to be electrically coupled withreceiving end 66 by being placed therein. Conductor 64 also has aterminal end (not shown) for connecting to an electrical apparatus. Aconnector such as connector 14, 44, or 56 may then be placed to biasdevice 58 towards substrate 60 to thereby retain the electricalconnection between bump 68 and recessed receiving end 66. It will beappreciated that the male/female complimentary fit shown in FIG. 7 wouldbe advantageous because of the structural integrity and non-slip designderived therefrom.

[0048] According to one method of manufacturing interposer 12 or 59, asubstrate 18 or 60 of the present invention is provided comprising aceramic material. At least one electrical conductor 20 or 64 is thencoupled onto the substrate. In one embodiment, recess 62 is formedwithin substrate 60, such as through etching, and at least a portion ofconductor 64 is placed within the recess 62. A recess may be formed toreceive receiving end 66, as shown in FIG. 7, the entire conductor, anintermediate portion of conductor 64 and end 66, or a variety of otherportions of conductor 64.

[0049] As yet another feature of the invention, as shown in FIG. 8, itis possible to form a layer 69, such as a coating, of an electricallyinsulating material on the intermediate portion 36 of electricalconductor 20 of interposer 12. The electrically insulating material forlayer 69 may comprise an electrically insulating material, such as apolymer or resin. In one embodiment, the electrically insulatingmaterial is thermally conductive, such as a ceramic material such asdescribed above (e.g., glass, aluminum nitride or alumina), for example.Thus, in one embodiment, layer 69 electrically insulates conductor 20from contact with an electrical conductor, such as an uninsulatedconnector, and simultaneously aids in heat dissipation.

[0050] With reference now to FIG. 9, interposer 12 having semiconductivedevices 16 electrically coupled thereto through the use of connectors14, 56 is electrically coupled to an electrical apparatus 70 such as atesting apparatus shown in a diagrammatic view in FIG. 9. Interposer 12may be permanently or removably coupled to apparatus 70.

[0051] As used throughout this specification and the appended claims,the term “electrical apparatus” refers to an apparatus whichelectrically couples to a semiconductive device. Examples of suchapparatuses include a computer, program logic controller, electronicgame assembly, a controlling module, and a testing apparatus whichmonitors, tests, or evaluates a semiconductive device. The testingapparatus may be a computerized testing apparatus, for example.

[0052] Apparatus 70 includes a socket, such as a printed circuit boardsocket, having electrical terminals onto which terminal ends 34 ofconductors 20 of interposer 12 are placed. After terminal ends 34 ofinterposer 12 are placed into the socket, an electrical connectionexists between semiconductive devices 16 and apparatus 70, therebyallowing a user to test device 16 or otherwise engage in a variety ofdifferent functions.

[0053] Thus, one method for testing semiconductive device comprisesproviding an interposer having substrate comprised of an electricallyinsulating, thermally conductive ceramic material, electrically couplingthe interposed to a semiconductive device, electrically coupling theinterposer to a testing apparatus such that the testing apparatus iselectrically coupled to semiconductive device, and then actuating thetesting apparatus to electrically communicate with the semiconductivedevice.

[0054] A variety of different semiconductive devices may be electricallycoupled to the inventive interposer. Examples of such semiconductivedevices include DRAMs, SRAMs, integrated circuit devices, and the like,each of which has electrical conductors thereon such as bumps, leadfingers, or other package connections. The semiconductive devices,however, may be either packaged or non-packaged.

[0055] The present invention may be embodied in other specific formswithout departing from its spirit or essential characteristics. Thedescribed embodiments are to be considered in all respects only asillustrative and not restrictive. The scope of the invention is,therefore, indicated by the appended claims rather than by the foregoingdescription. All changes which come within the meaning and range ofequivalency of the claims are to be embraced within their scope.

What is claimed and desired to be secured by United States LettersPatent is:
 1. A system for electrically coupling a semiconductive deviceto an electrical apparatus, the system comprising: an interposer, theinterposer comprising: a substrate comprised of an electricallyinsulating ceramic material; and a plurality of electrical conductors onthe substrate, each electrical conductor having a receiving end forconnecting to a semiconductive device and a terminal end for connectingto an electrical apparatus, such that electrical circuitry within thesemiconductive device is electrically coupled to the electricalapparatus when the semiconductive device is connected to said pluralityof receiving ends of the electrical conductors and said plurality ofterminal ends of the electrical conductors are connected to theelectrical apparatus; and a connector for holding the semiconductivedevice stationary relative to the interposer.
 2. A system as recited inclaim 1 , wherein the connector connects the semiconductive device tothe interposer such that a portion of the semiconductive device isexposed to the atmosphere to thereby dissipate heat to the atmosphere.3. A system as recited in claim 1 wherein the connector removablyconnects the semiconductive device to the interposer.
 4. A system asrecited in claim 1 , wherein the connector comprises a resilient biasingclip.
 5. A system as recited in claim 1 , wherein the connector iscomposed of a metal material.
 6. A system as recited in claim 1 ,wherein the connector comprises an adhesive.
 7. A system as recited inclaim 1 , wherein at least one of said receiving ends projects from thesubstrate.
 8. A system as recited in claim 1 , wherein at least one ofsaid receiving ends is disposed within a recess in the substrate.
 9. Asystem for testing a semiconductive device, the system comprising: anelectrical testing apparatus; a semiconductive device having anelectrical circuitry therein electrically connected to an electricallead projecting therefrom; an interposer, the interposer comprising: asubstrate comprised of an electrically insulating material selected fromthe group consisting of glass, alumina, glass ceramic, nonmetallicnitride, aluminum nitride, nonmetallic carbide, and mixtures andderivatives thereof; and an electrical conductor on the substrate, theelectrical conductor having a receiving end for connecting to theelectrical lead of the semiconductive device and a terminal end forconnecting to the electrical testing apparatus, whereby thesemiconductive device is electrically coupled to the electrical testingapparatus when the electrical lead of the semiconductive device is incontact with the receiving end of the electrical conductor and theterminal end of the electrical conductor is in electrical communicationwith the electrical testing apparatus.
 10. The system as defined inclaim 9 , further comprising: a connector for biasing the electricallead of the semiconductive device towards and in contact with thereceiving end of the electrical conductor, the connector being composedof copper and alloys thereof.
 11. The system as defined in claim 10 ,wherein the connector has a coating thereon composed of an electricallyinsulating material.
 12. A system as recited in claim 10 , wherein theconnector connects the semiconductive device to the interposer such thata portion of the semiconductive device is exposed to the atmosphere tothereby dissipate heat to the atmosphere.
 13. A system as recited inclaim 10 , wherein the connector removably connects the semiconductivedevice to the interposer.
 14. A system as recited in claim 10 , whereinthe connector comprises a resilient biasing clip.
 15. A system asrecited in claim 10 , wherein the connector is composed of a metalmaterial.
 16. A system as recited in claim 10 , wherein the connectorcomprises an adhesive.
 17. A system as recited in claim 9 , wherein atleast one of said receiving ends projects from the substrate.
 18. Asystem as recited in claim 9 , wherein at least one of said receivingends is disposed within a recess in the substrate.
 19. A system forelectrically coupling a semiconductive device to an electricalapparatus, the system comprising: an interposer, the interposercomprising: a substrate comprised of an electrically insulating, ceramicmaterial; and an electrical conductor on the substrate, the electricalconductor having a receiving end for connecting to the semiconductivedevice and a terminal end for connecting to the electrical apparatus;and a connector for holding the semiconductive device stationaryrelative to the interposer.
 20. The system as defined in claim 19 ,wherein the substrate comprises a substantially planar sheet.
 21. Thesystem as defined in claim 19 , wherein the substrate comprises asubstantially homogenous material.
 22. The system as defined in claim 19, wherein the receiving end protrudes upwardly with respect to thesubstrate.
 23. The system as defined in claim 19 wherein the receivingend is disposed within a recess in the substrate.
 24. The system asdefined in claim 19 , wherein the substrate comprises a materialselected from the group consisting of glass, alumina, glass ceramic,nonmetallic nitride, aluminum nitride, nonmetallic carbide, and mixturesand derivatives thereof.
 25. The system as defined in claim 19 , whereinthe substrate comprises boron nitride.
 26. The system as defined inclaim 19 , wherein the interposer further comprises an electricallyinsulating layer on a portion of the conductor between the receiving endand the terminal end.
 27. The system as defined in claim 26 , whereinthe electrically insulating layer comprises a thermally conductivematerial.
 28. A system as recited in claim 19 , wherein the connectorconnects the semiconductive device to the interposer such that a portionof the semiconductive device is exposed to the atmosphere to therebydissipate heat to the atmosphere.
 29. A system as recited in claim 19 ,wherein the connector removably connects the semiconductive device tothe interposer.
 30. A system as recited in claim 19 , wherein theconnector comprises a resilient biasing clip.
 31. A system as recited inclaim 19 , wherein the connector is composed of a metal material.
 32. Asystem as recited in claim 19 , wherein the connector comprises anadhesive.
 33. A system as recited in claim 19 , wherein at least one ofsaid receiving ends projects from the substrate.
 34. A system as recitedin claim 19 , wherein at least one of said receiving ends is disposedwithin a recess in the substrate.
 35. A system for electrically couplinga semiconductive device to an electrical apparatus, the systemcomprising: an interposer, the interposer comprising: a substantiallyhomogeneous, substantially planar sheet comprised of an electricallyinsulating, inorganic ceramic material; and an electrical conductor onthe sheet, the electrical conductor having a receiving end forconnecting to a semiconductive device and a terminal end for connectingto an electrical apparatus, such that the semiconductive device iselectrically coupled to the electrical apparatus when the semiconductivedevice is connected to the receiving end of the electrical conductor andthe terminal end of the electrical conductor is connected to theelectrical apparatus; and a connector for holding the semiconductivedevice stationary relative to the interposer.
 36. The system as recitedin claim 35 , wherein the substrate consists essentially of alumina. 37.The system as recited in claim 35 , wherein the substrate consistsessentially of a glass ceramic material.
 38. A system as recited inclaim 35 , wherein the connector connects the semiconductive device tothe interposer such that a portion of the semiconductive device isexposed to the atmosphere to thereby dissipate heat to the atmosphere.39. A system as recited in claim 35 , wherein the connector performs afunction selected from the group consisting of: removably connects thesemiconductive device to the interposer; resiliently biases thesemiconductive device to the interposer; and adhesivively connects thesemiconductive device to the interposer.
 40. A system as recited inclaim 35 , wherein at least one of said receiving ends projects from thesubstrate.
 41. A system as recited in claim 35 , wherein at least one ofsaid receiving ends is disposed within a recess in the substrate.
 42. Asystem for electrically coupling a semiconductive device to anelectrical apparatus, the system comprising: an interposer, theinterposer comprising: a substantially homogeneous, substantially planarsheet composed of an electrically insulating material selected from thegroup consisting of glass ceramics, devitrified ceramics, vitroceramics, alumina, single oxide ceramics, and mixed oxide ceramics, andmixtures and derivatives thereof; and an electrical conductor on thesheet, the electrical conductor having a receiving end for connecting tothe semiconductive device and a terminal end for connecting to theelectrical apparatus, such that the semiconductive device iselectrically coupled to the electrical apparatus when the semiconductivedevice is connected to the receiving end of the electrical conductor andthe terminal end of the electrical conductor is connected to theelectrical apparatus a connector for holding the semiconductive devicestationary relative to the interposer.
 43. A system as recited in claim42 , wherein the connector performs a function selected from the groupconsisting of: removably connects the semiconductive device to theinterposer; resiliently biases the semiconductive device to theinterposer; and adhesivively connects the semiconductive device to theinterposer.
 44. A system as recited in claim 42 , wherein at least oneof said receiving ends projects from the substrate.
 45. A system asrecited in claim 42 , wherein at least one of said receiving ends isdisposed within a recess in the substrate.
 46. A system as recited inclaim 42 , wherein the connector connects the semiconductive device tothe interposer such that a portion of the semiconductive device isexposed to the atmosphere to thereby dissipate heat to the atmosphere.47. A system for electrically coupling a semiconductive device to anelectrical apparatus, the system comprising: an interposer, theinterposer comprising: a substantially homogeneous, substantially planarsheet composed of an electrically insulating material selected from thegroup consisting of alumina, alumina with silica, alumina withsilicates, alumina with derivatives of silicates, and mixtures andderivatives thereof; and an electrical conductor on the sheet, theelectrical conductor having a receiving end for connecting to thesemiconductive device and a terminal end for connecting to theelectrical apparatus, such that the semiconductive device iselectrically coupled to the electrical apparatus when the semiconductivedevice is connected to the receiving end of the electrical conductor andthe terminal end of the electrical conductor is connected to theelectrical apparatus a connector for holding the semiconductive devicestationary relative to the interposer.
 48. A system as recited in claim47 , wherein the connector performs a function selected from the groupconsisting of: removably connects the semiconductive device to theinterposer; resiliently biases the semiconductive device to theinterposer; and adhesivively connects the semiconductive device to theinterposer.
 49. A system as recited in claim 47 , wherein at least oneof said receiving ends projects from the substrate.
 50. A system asrecited in claim 47 , wherein at least one of said receiving ends isdisposed within a recess in the substrate.
 51. A system as recited inclaim 47 , wherein the connector connects the semiconductive device tothe interposer such that a portion of the semiconductive device isexposed to the atmosphere to thereby dissipate heat to the atmosphere.52. A system for electrically coupling a semiconductive device to anelectrical apparatus, the system comprising: an interposer, theinterposer comprising: a substantially homogeneous, substantially planarsheet composed of an electrically insulating material selected from thegroup consisting of boron nitrides, aluminum nitrides, and mixtures andderivatives thereof; and an electrical conductor on the sheet, theelectrical conductor having a receiving end for connecting to asemiconductive device and a terminal end for connecting to an electricalapparatus, such that the semiconductive device is electrically coupledto the electrical apparatus when the semiconductive device is connectedto the receiving end of the electrical conductor and the terminal end ofthe electrical conductor is connected to the electrical apparatus aconnector for holding the semiconductive device stationary relative tothe interposer.
 53. A system as recited in claim 52 , wherein theconnector performs a function selected from the group consisting of:removably connects the semiconductive device to the interposer;resiliently biases the semiconductive device to the interposer; andadhesivively connects the semiconductive device to the interposer.
 54. Asystem as recited in claim 52 , wherein at least one of said receivingends projects from the substrate.
 55. A system as recited in claim 52 ,wherein at least one of said receiving ends is disposed within a recessin the substrate.
 56. A system as recited in claim 52 , wherein theconnector connects the semiconductive device to the interposer such thata portion of the semiconductive device is exposed to the atmosphere tothereby dissipate heat to the atmosphere.
 57. A system for electricallycoupling a semiconductive device to an electrical apparatus, the systemcomprising: an interposer, the interposer comprising: a substantiallyhomogeneous, substantially planar sheet composed of an electricallyinsulating material selected from the group consisting of oxides ofsilicon, silicate glass, and nucleated, substantially crystalline glass,and mixtures and derivatives thereof; and an electrical conductor on thesheet, the electrical conductor having a receiving end for connecting tothe semiconductive device and a terminal end for connecting to theelectrical apparatus, such that the semiconductive device iselectrically coupled to the electrical apparatus when the semiconductivedevice is connected to the receiving end of the electrical conductor andthe terminal end of the electrical conductor is connected to theelectrical apparatus a connector for holding the semiconductive devicestationary relative to the interposer.
 58. A system as recited in claim57 , wherein the connector performs a function selected from the groupconsisting of: removably connects the semiconductive device to theinterposer; resiliently biases the semiconductive device to theinterposer; and adhesivively connects the semiconductive device to theinterposer.
 59. A system as recited in claim 57 , wherein at least oneof said receiving ends projects from the substrate.
 60. A system asrecited in claim 57 , wherein at least one of said receiving ends isdisposed within a recess in the substrate.
 61. A system as recited inclaim 57 , wherein the connector connects the semiconductive device tothe interposer such that a portion of the semiconductive device isexposed to the atmosphere to thereby dissipate heat to the atmosphere.